|TUPC01||Study of Copper Microstructure Produced by Electroforming for the 180-GHz Frequency Corrugated Waveguide||178|
Funding: Work supported by Laboratory Directed Research and Development funding from Argonne National Laboratory, provided by the Director, Office of Science, of the US DOE under contract DE-AC02-06CH11357.
Fabrication of the corrugated structure that generates a field gradient 100 m-1 at 180 GHz is challenging and required an unconventional method of production. The corrugated waveguide with 2 mm inner diameter will be produced by electroplating copper on the aluminum mandrel as proposed in the reference*. A thin seed layer is usually applied to achieve uniform wetting to plate copper on the aluminum mandrel. The copper waveguide is retrieved by removing aluminum and the seed layer. Therefore, uniform copper plating and etching of the seed layer and the Aluminum mandrel is a crucial step to keep the surface free of impurities that are especially necessary for the RF application. Previous studies suggest that electroplated copper has variations in both electrical and mechanical properties compared with those of bulk copper from the batches of production. In this paper, we discuss the copper microstructure produced by the electroforming method and literature study on the variations, which can be attributed to the disparity of the crystallinity of grains structure in plated material.
*A. Zholentset al., "A Conceptual Design of a Compact Wakefield Accelerator for a High Repetition Rate Multi-User X-ray Free-Electron Laser Facility, "in Proc. IPAC 18, 2018, pp. 1266-1268.
|Poster TUPC01 [1.717 MB]|
|DOI •||reference for this paper ※ https://doi.org/10.18429/JACoW-MEDSI2020-TUPC01|
|About •||paper received ※ 21 July 2021 paper accepted ※ 05 November 2021 issue date ※ 06 November 2021|
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