Author: Popovic, B.K.
Paper Title Page
TUPB06 Design of Miniature Waveguides and Diamond Window Assembly for RF Extraction and Vacuum Isolation for the CWA 156
 
  • B.K. Popovic, S.H. Lee, S. Sorsher, K.J. Suthar, E. Trakhtenberg, G.J. Waldschmidt, A. Zholents
    ANL, Lemont, Illinois, USA
  • A.E. Siy
    UW-Madison, Madison, Wisconsin, USA
 
  Funding: This manuscript is based upon work supported by Laboratory Directed Research and Development (LDRD) funding from Argonne National Laboratory
This paper outlines the design of a diamond vacuum window and a millimeter wavelength (mmWave) waveguide assembly that will hold vacuum but still allow the mmWaves to propagate out of the structure for diagnosis and thermal management purposes. Currently under development at Argonne is a corrugated wakefield accelerator (CWA) that will operate at mmWave frequencies, with its fundamental mode of operation at 180 GHz, and relatively high power levels, up to 600 W. The fundamental mode needs to be extracted from the accelerator at approximately every 0.5 m to prevent the unwanted heating of the accelerator structure. Therefore, the structure is intentionally designed so this fundamental mode does not propagate further, instead it is transmitted through the waveguide assembly under vacuum and out via the vacuum window. As a result of the relatively high mmWave power densities, CVD diamond was chosen as the vacuum window material, due to its low electromagnetic losses, mechanical strength, and for its superior thermo-physical properties. Mechanically it is necessary to be able to hold the tight tolerances necessary for windows performance at millimeter wavelengths. Other mechanical difficulties involve assembly of the window due to CVD diamond material and preservation of ultra high vacuum even if the integrity of the CVD diamond window is somehow compromised.
 
poster icon Poster TUPB06 [0.386 MB]  
DOI • reference for this paper ※ https://doi.org/10.18429/JACoW-MEDSI2020-TUPB06  
About • paper received ※ 26 July 2021       paper accepted ※ 05 October 2021       issue date ※ 02 November 2021  
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