Keyword: electronics
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TUPC06 A Review of Ultrasonic Additive Manufacturing for Particle Accelerator Applications electron, controls, embedded, interface 185
  • J.A. Brandt
    Enrico Fermi Institute, University of Chicago, Chicago, Illinois, USA
  Additive manufacturing (AM) technologies have been used for prototyping and production parts in many industries. However, due to process limitations and the unknown material properties of AM parts, there has been limited adoption of the technology in accelerator and light-source facilities. Ultrasonic Additive Manufacturing (UAM) is a hybrid additive-subtractive manufacturing process that uses a solid-state ultrasonic bonding mechanism attached to a CNC mill to join and machine metal parts in a layer-by-layer manner. The solid-state and hybrid nature of UAM ensures base material properties are retained and mitigates process limitations which traditionally inhibit integration of parts produced by other AM processes. This paper presents a review of the UAM process and its potential application to accelerator and beamline needs. Several specific areas are discussed including: replacement of traditional manufacturing approaches, such as explosion bonding to join dissimilar metals; improved internal cooling channel fabrication for thermal management; and imbedding of electronics and materials for more accurate remote sensing and radiation shielding.  
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About • paper received ※ 22 July 2021       paper accepted ※ 16 October 2021       issue date ※ 05 November 2021  
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